Ceramic circuit boards are actually made of electronic ceramic material and can be made into a variety of shapes. Among them, the ceramic circuit board has the most prominent characteristics of high temperature resistance, high electrical insulation performance, has the advantages of low dielectric constant, low dielectric loss, high thermal conductivity, good chemical stability, similar thermal expansion coefficient of components. Ceramic printed circuit boards are produced by laser rapid activation metallization (LAM) technology. Used in LED field, high power semiconductor modules, semiconductor coolers, electronic heaters, power control circuits, power hybrid circuits, intelligent power components, high frequency switching power supplies, solid state relays, automotive electronics, communications, aerospace and military electronics components.
Unlike conventional FR-4 (glass fiber), ceramic materials have excellent high frequency properties and electrical properties, as well as high thermal conductivity, chemical stability and thermal stability. Ideal packaging material for the generation of large scale integrated circuits and power electronics modules.
1, higher thermal conductivity
2, better match the coefficient of thermal expansion
3, a hard, low resistance metal film alumina ceramic circuit board
4. The solderability of the substrate is good and the operating temperature is high.
5, good insulation
6, low frequency loss
7. Assemble with high density
8. No organic components, resistance to cosmic rays, high reliability in aerospace and long service life
9, copper layer does not contain oxide layer, can be used in reducing atmosphere for a long time.
Ceramic printed circuit board technology manufacturing process introduction - hole holes
With the development of high-power electronic products to miniaturization and high-speed direction, the traditional FR-4, aluminum substrate materials are no longer suitable for the development of high power and high power. With the progress of science and technology, the intelligent application of PCB industry. The traditional LTCC and DBC technologies are gradually replaced by DPC and LAM technologies. Laser technology represented by LAM technology is more in line with the development of high density interconnection and fineness of printed circuit board. Laser drilling is the front-end and mainstream drilling technology in PCB industry. The technology is efficient, fast, accurate and has high application value. Rayming Ceramic circuit board is fabricated by laser rapid activation metallization technology. The bonding strength between the metal layer and the ceramic is high, the electrical properties are good, and the welding can be repeated. The thickness of the metal layer can be adjusted in the range of 1μm to 1mm to achieve L/S resolution. 20μm, can be directly implemented through the connection, to provide customers with customized solutions.
The Lateral Excited Atmospheric CO2 Laser, developed by a Canadian company, offers 100 to 1,000 times more power output than conventional lasers and is easy to manufacture. In the electromagnetic spectrum, the radio frequency is in the frequency range of 105-109Hz, and with the development of military and aerospace technology, the secondary frequency is emitted. Medium and small power RF CO2 laser has excellent modulation performance, stable power and high operating reliability. Long life and other characteristics. UV solid YAG is widely used in plastics and metals in the microelectronics industry. Although CO2 laser drilling process is more complex, but the production effect of microaperture is better than UV solid YAG, but CO2 laser has the advantages of high efficiency and high speed stamping, PCB laser micropore processing market share can be domestic laser micropore manufacturing is still in the development stage, and there are not many enterprises can put into production.
Domestic laser microporous manufacturing is still in the development stage. Short pulses and peak power lasers are used to drill holes into PCB substrates for high density energy, material removal and micropore formation. Ablation is divided into photothermal ablation and photochemical ablation. Photothermal ablation refers to the hole formation process by the substrate material rapidly absorbing high energy laser. Photochemical ablation refers to a combination of photonic energy in the ultraviolet region in excess of 2eV electron volts and laser wavelengths in excess of 400nm. The manufacturing process can effectively break down the long molecular chains of organic materials and form smaller particles, which can rapidly form micropores under the action of external forces.
Today, China's laser drilling technology has a certain amount of experience and technical progress. Compared with the traditional stamping technology, laser drilling technology has high precision, high speed, high efficiency, large-scale batch punching, suitable for most hard and soft materials, no loss of tools, waste generation. Less materials, environmental protection, pollution-free advantages.
Ceramic circuit board through laser drilling process, high binding force between ceramic and metal, do not fall off, foaming, and the effect of growth together, high surface smoothness, roughness ratio 0.1 micron to 0.3 micron, laser hole diameter from 0.15 mm to 0.5 mm, or even 0.06 mm.
Ceramic circuit board manufacturing - etching
The circuit pattern is pre-coated with a lead-tin resist on the copper foil that remains on the outer layer of the circuit board, and then chemically etched the copper from the unprotected, non-conducting parts to form the circuit.
According to different process methods, etching is divided into inner layer etching and outer layer etching, inner layer etching is acid etching, wet film or dry film M used as corrosion inhibitor; The outer layer is etched as alkaline etching, tin and lead used as resist.